ABOUT WESEMiBAY
About WESEMIBAY
The WESEMiBAY SEMICONDUCTOR ECOSYSTEM EXPO, or WESEMiBAY is aimed at implementing the shenzhen “20+8” industrial “One Cluster, One Expo” policy initiative. It is guided by China International Engineering Consulting Corporation, and organized by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance(SICA) and Shenzhen Major Industry Investment Group Co., Ltd., and undertaken by Shenzhen Xinmeng Exhibition Co., Ltd. Fully leveraging the extensive application market and premium resources of Shenzhen and the Greater Bay Area, including major industrial project clusters, the event focuses on key areas such as semiconductor equipment, components, materials, advanced packaging, IC design and third-generation semiconductors, etc.
The WESEMiBAY seeks to promote collaborative and win-win development across the semiconductor industry chain, constructing a healthy development ecosystem for China's semiconductor industry from four dimensions: Industry Ecosystem, Technology Ecosystem, Capital Ecosystem, and Talent Ecosystem. It aims to build a platform for in-depth integration, exchange, and cooperation between the domestic and international semiconductor industry chain, supply chain, and value chain.
Exhibition Layout
Wafer Fabrication
- Wafer Fabrication Equipment, Etching Equipment, Metrology Equipment, etc.
- Wafer Fabrication Materials, Wafers, Specialty chemicals, Photolithography Materials, etc.
- Components & Parts, Metal Components, Valves, Pumps, Vacuum Systems, etc.
- Facility Management (FM) and Other Services
Compound Semiconductors
- Compound Semiconductor Materials Such as SiC, GaN, GaAs, Ga2O3 & Diamond, etc.
- Compound Semiconductor Equipment, Crystal Growth Equipment, Epitaxial Equipment, etc.
- Compound Semiconductor Materials, Substrate Materials, Epitaxial Materials, etc.
- Compound Semiconductor Devices
- Compound Semiconductor Design & Manufacturing Services
IC Design / AI Infrastructure
- IC Design / AI Infrastructure Exhibition Zone
- AI Chips & Computing Architectures
- Servers & Intelligent Computing Centers
- Cloud, Network, Computing, Storage & Data Infrastructure
- Power Supply, Liquid Cooling & Green Computing Infrastructure
- Software & Model Infrastructure
- Physical AI & Industry Applications
Advanced Packaging
- Packaging & Testing Service Providers
- Packaging & Testing Equipment
- Advanced Packaging Materials
- Glass Substrates & TGV Processes
- Components & Indirect Consumables
- Green Facility Management & Supporting Infrastructure
WESEMiBAY Conference
2026 Supporting Units & Sponsors
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